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Wafer Tape Mounter

Wafer Tape Mounter

SEMICONDUCTOR AUTOMATION

Wafer Tape Mounter

SAW LAMINATE · FULL AUTO

SEMICONDUCTOR AUTOMATION

Wafer Tape Mounter (SAW Laminate)

After supplying and aligning the wafer and carrier separately, blue tape is automatically attached. Automatic transfer and laminating improve productivity and maintain stable quality.
Full Auto · Separate Wafer & Carrier Supply · 6-inch Dedicated
Wafer Tape Mounter (SAW Laminate)

EQUIPMENT CONFIGURATION

Equipment Configuration

Five core units from Main Frame to Tape Loading & Rolling Unit.
Wafer Tape Mounter equipment layout

CORE UNITS

  1. 01Main Frame & Control Panel
  2. 02Mounter Chuck Sliding Unit
  3. 03Carrier Elevator Unit
  4. 04Wafer Elevator Unit
  5. 05Tape Loading & Rolling Unit

EQUIPMENT OPERATION SEQUENCE

Equipment Operation Sequence

A 12-step process from wafer input to carrier magazine output.
  1. 01

    WAFER INPUT

    Wafer Input

  2. 02

    EDGE DETECTION

    Edge Detection

  3. 03

    WAFER ROTATION

    Wafer Rotation

  4. 04

    D-CUT ALIGN

    D-Cut Alignment

  5. 05

    WAFER FLIP

    Wafer Flip

  6. 06

    WAFER CHUCK

    Wafer Chuck Placement

  7. 07

    CARRIER INPUT

    Carrier Input

  8. 08

    CARRIER CHUCK

    Carrier Chuck Placement

  9. 09

    TAPE LAMINATING

    Tape Laminating

  10. 10

    TAPE CUTTING

    Tape Cutting

  11. 11

    TAPE RECOVERY

    Tape Recovery & Home Return

  12. 12

    MAGAZINE OUT

    Magazine Output

OPERATION METHODS

Operation Methods

Wafer and carrier are supplied and aligned separately, then connected to the tape & rolling process.
WAFER SUPPLY

WAFER SUPPLY

A wafer loaded by the elevator and pusher is recognized at the D-cut position by the alignment and rotation units. After the alignment position is determined by a BLDC Motor 30W and fiber sensor, it is transferred to the mounter chuck through the vacuum unit and vacuum pad.

CARRIER SUPPLY

CARRIER SUPPLY

A carrier loaded by the elevator and pusher is aligned at the neutral block. The aligned carrier is transferred to the mounter chuck through the vacuum unit and vacuum pad, and the magazine elevator consists of a BLDC Motor 30W and ball screw.

TAPE & ROLLING

TAPE & ROLLING

The mounter chuck moves by an electric unit based on LM guide and ball screw, and the tape roller descends to perform laminating. After completion, the chuck returns to its original position and the product is loaded into the carrier magazine.

TECHNICAL SPECIFICATIONS

Main Specifications

Equipment size, applicable wafer, power/air supply, control, and major component specifications.
Model
P-ST X2 SMF
Equipment Size
825(W) × 1100(D) × 1750(H) mm
Input Power
Single-phase 220 VAC ±10% / 50·60 Hz
Supplied Air Pressure
5 bar
Applicable Wafer Size
6-inch dedicated
HMI / PLC
M2i 7 inch Touch Panel / LG PLC XBC-DN32H
Motor
LS Servo 400W / BLDC 50W·30W
Frame / Main Components
Steel tube frame · powder coating / Autonics fiber sensor SMC·TPC pneumatic device

※ Tower lamp is not included in equipment height.
※ Actual manufacturing specifications may change depending on customer consultation and applicable process conditions.

MEDIA & RESOURCES

Equipment Video and Technical Materials

Check the actual equipment operation video and product manual.
EQUIPMENT VIDEOWatch Equipment Operation Video

PRODUCT MANUAL

Request Equipment Manual

Request the manual for delivery by email after review.

PROJECT CONSULTATION

Considering Wafer Tape Mounter adoption?

We propose the optimal automation configuration based on process conditions and production goals.
Equipment Adoption Inquiry