WAFER SUPPLY & D-CUT ALIGN
The wafer is loaded by the elevator and pusher, the D-cut is aligned by three bearings, and a triangular-support circular gripper transfers it to the mounter chuck.
SEMICONDUCTOR AUTOMATION
Auto Tape Lift Off
AUTO TAPE LIFT OFF · DETAPESEMICONDUCTOR AUTOMATION
Auto Tape Lift Off (Detape)
This equipment automatically removes the target film using blue tape for the wafer photoresist strip process. It automates wafer input, D-cut alignment, tape laminating, de-tape, and output to maintain productivity and stable quality.
Minimizes foreign matter and residual PR after lift-off · Prevents wafer damage during operation · UPH to be discussed with customer
EQUIPMENT CONFIGURATION
Equipment Configuration
Core module configuration for stable wafer transfer and tape processing.
NO. / PART NAMENO. / PART NAME
01Wafer Chuck Unit
02In Magazine Unit
03Out Magazine Unit
04Tape Input
05400W Servo Motor
06Tape Output
AUTOMATED PROCESS
Equipment Operation Sequence
9-step automatic circulation process from wafer input to magazine output- 01
WAFER LOADING
Wafer Input
- 02
WAFER ALIGN
3-Point Bearing D-Cut Alignment
- 03
GRIPPER PICK-UP
Gripper Descent and Wafer Pick-up
- 04
CHUCK PLACEMENT
Wafer Chuck Placement
- 05
TAPE LAMINATING
Tape Roller Forward/Backward Laminating
- 06
DE-TAPE
Blue Tape and PR Removal by Swing Arm
- 07
CHUCK RETURN
Chuck Home Return
- 08
UNLOADER TRANSFER
Wafer Unloader Transfer
- 09
MAGAZINE OUTPUT
Cassette Insertion and Magazine Output
OPERATION METHOD
Operation Method
Organically connects wafer supply/output, tape & rolling, and de-tape processes.
UNLOADER TRANSFER & CASSETTE OUTPUT
The lift-off completed wafer is transferred to the unloader opposite the loader and stably inserted into the cassette by a two-stage pusher.
Tape & Rolling
The mounter chuck is moved pneumatically, and the tape roller moves forward/backward to uniformly laminate blue tape on the wafer surface.
DE-TAPE
After forming the tape angle with an auxiliary roller, blue tape is separated by the arc motion of the servo motor and one-way bearing swing arm while removing PR from the wafer surface.
TECHNICAL SPECIFICATIONS
Specifications and Main Components
Equipment size, utilities, control/drive, and major component specifications- Model
- P-ST X2 DTF
- Estimated Equipment Size
- 750(W) × 1100(D) × 1697.5(H) mm (Tower lamp excluded)
- Input Power
- Single-phase 220 VAC ±10% / 50/60 Hz
- Supplied Air Pressure
- Min. 5 bar
- Applicable Wafer Size
- 6-inch dedicated
- Electrical Operation
- M2i 7 inch Touch Panel
- Electrical Main
- LG PLC / XBC-DN32H
- Motor
- LS Servo Motor 400W / BLDC Motor 50W / 30W
- Electrical Components & Others
- Fiber Sensor / Autonics
- Pneumatic Device
- SMC & TPC
※ Detailed specifications may change depending on the applicable process and customer consultation conditions.
MEDIA & RESOURCES
Equipment Video and Technical Materials
Check the actual equipment operation video and product manual.
PRODUCT MANUAL
Request Equipment Manual
Request the manual for delivery by email after review.PROJECT CONSULTATION