EXTERNAL PARTS OVERVIEW
External Equipment Configuration
- 01Power and Operation Monitor
- 02Center Scanning
- 03Vision Inspection
- 04Vision PC
- 05Ring Frame Tape Attachment and Scrap Winding
- 06Cassette Output
SEMICONDUCTOR AUTOMATION
Wafer Vision Tape Mounter
DUAL VISION ALIGNMENT · RING FRAME TAPE MOUNTINGSEMICONDUCTOR AUTOMATION
Wafer Vision Tape Mounter
This 6-inch dedicated vision tape mounter automatically supplies ring frames, inspects and aligns wafer patterns by vision, and performs the tape mounting process.
Ring Frame Supply · Wafer Pattern Inspection & Alignment · Tape Mounting
EQUIPMENT CONFIGURATION
Equipment Configuration
External equipment configuration and internal layoutFRONT VIEW · EXTERNAL PARTS
TOP VIEW · INTERNAL LAYOUT
INTERNAL LAYOUT OVERVIEW
Equipment Top-View Layout
- 01Wafer Carrier Supply Elevator
- 02Wafer Center Scanning
- 03Vision Pattern and View Inspection
- 04Tape Mount
- 05Tape Round Cutting
- 06Tape Scrap Winding
- 07Ring Frame Transfer
- 08Ring Frame Vacuum Chuck
- 09Cassette Output Elevator
- 10Cassette Input
PROCESS SUMMARY
Operation Process
An automated process from wafer loading to vision inspection, ring frame supply, tape mounting, and output.
WAFER LOADING
Loads the carrier with wafers from the cassette (magazine) into the process.
VISION INSPECTION
Motion reads and picks the wafer center from the carrier boat and transfers it to the vision position. The primary vision reads the pattern and performs rotational alignment, and the secondary vision corrects it before placing it at the center of the vacuum chuck table.
RING FRAME SUPPLY
Supplies and seats the ring frame on the vacuum chuck table for tape mounting.
TAPE MOUNTING
When the vacuum chuck table holding the wafer and ring frame enters below the roll, vacuum is formed and tape is attached. After round cutting, tape scrap is removed and the unit returns to the standby position.
OUTPUT
Returns the ring frame after tape mounting to the home position, loads it step by step into the cassette, and outputs it.
SPECIFICATIONS
Basic Specifications
Equipment size, utilities, drive/control, vision, and production conditions- Model
- P-ST X2 VMF
- Equipment Size
- 1400 × 1150 × 2350 mm (L × W × H)
- Monthly Production Capacity
- 10,000–20,000 sheets / month
- Input Power
- Single-phase 220 VAC ±10% · 50/60 Hz
- Air Pressure
- 5 bar
- Wafer Specification
- 6 inch dedicated
- Tact Time
- 2 min / sheet
- Operation Mode
- Auto / Manual / 1 Cycle 1 Step
- HMI / PLC
- M2i 10.4 inch Touch Panel / LS XGT
- Servo Motor
- LS AC Servo 400 / 200 / 100 / 50W
- Vision System
- 2-axis Vision + Lighting + PC Program
- Slider Unit
- DT-1 Type / THK
- Pneumatic
- SMC & TPC
- Sensor
- Fiber Sensor / Autonics
※ Actual manufacturing specifications may change depending on customer consultation and applicable process conditions.
MEDIA & RESOURCES
Equipment Video and Technical Materials
Check the actual equipment operation video and product manual.
PRODUCT MANUAL
Request Equipment Manual
Request the manual for delivery by email after review.PROJECT CONSULTATION