WAFER SUPPLY & D-CUT ALIGN
The wafer is loaded by the elevator and pusher, and after the alignment/rotation unit recognizes the D-cut position, it is transferred to the mounter chuck.
SEMICONDUCTOR AUTOMATION ·
Auto UV Irradiation System
AUTO UV IRRADIATION SYSTEMSEMICONDUCTOR AUTOMATION · 05
Auto UV Irradiation System
This equipment performs product input/output and UV lamp irradiation in full-auto mode so UV tape can be easily separated from the wafer surface. It is designed to control irradiation dose by product and maintain productivity and stable quality.
Full Auto · 6-inch Dedicated · Product-Specific UV Dose Control · External UV Exposure Prevention
EQUIPMENT CONFIGURATION
Equipment Configuration
Core unit configuration that performs wafer supply/transfer, UV irradiation, and finished product output in full-auto mode.
NO. / PART NAMENO. / PART NAME
01Carrier Transfer | Servo Motor/400w
02Carrier Elevator | BLDC Motor/50w
037” Touch panel
04UV unit Ass’y | Lamp - 4EA
05Under Transfer Unit
AUTOMATED PROCESS
Equipment Operation Sequence
12-step full-auto process from UV system start-up to finished cassette output- 01
UV SYSTEM ON
UV System Power ON
- 02
LAMP CHECK
Check Normal UV Lamp Operation
- 03
WAFER INPUT
Wafer Input
- 04
EDGE DETECTION
Wafer Edge Detection
- 05
WAFER LOADING
Automatic Wafer Transfer
- 06
POSITIONING
Positioning in UV Irradiation Area
- 07
UV IRRADIATION
Product-Specific UV Irradiation
- 08
DOSE ADJUSTMENT
UV Dose Condition Adjustment
- 09
RECIPE STORAGE
Save Product-Specific UV Irradiation Time
- 10
AUTO IRRADIATION
Automatic UV Irradiation
- 11
UV COMPLETE
UV Irradiation Complete
- 12
CASSETTE OUTPUT
Finished Product Alignment and Cassette Output
OPERATION METHOD
Operation Method
Continuously controls wafer supply, D-cut alignment, UV irradiation, finished product output, and safety/thermal management functions.
UV IRRADIATION CONTROL
After seating the wafer in the irradiation area, product-specific UV irradiation is performed. Irradiation dose and time are adjusted and managed according to product conditions.
FINISHED PRODUCT ALIGNMENT
The wafer after UV irradiation is aligned in the cassette, loaded step by step, and discharged stably.
SAFETY & THERMAL MANAGEMENT
The UV lamp is shielded to prevent direct external exposure, internal fans dissipate heat, and product damage during operation is prevented.
TECHNICAL SPECIFICATIONS
Specifications and Main Components
Equipment type and size, control/drive, major components, and operating conditions- Model
- P-ST X2 AUF
- Equipment Size
- 1080(W) × 750(D) × 1750(H) mm (Tower lamp excluded)
- Input Power
- Single-phase 220 VAC ±10% / 50/60 Hz
- Applicable Wafer Size
- 6-inch dedicated
- Electrical Operation
- M2i 7 inch Touch Panel
- Electrical Main
- LG PLC / XBC-DN32H
- Motor
- LS Servo Motor 400W / BLDC Motor 50W / 30W etc.
- Frame and Cover
- Steel tube frame and powder coating
- Electrical Components & Others
- Fiber Sensor / Autonics
- Pneumatic Device
- SMC & TPC
※ Detailed specifications may change depending on the applicable process and customer consultation conditions.
TECHNICAL DOWNLOAD
Equipment Manual and Technical Materials
Download the manual to check equipment specifications and operating information.
PRODUCT MANUAL
Request Equipment Manual
Request the manual for delivery by email after review.PROJECT CONSULTATION